MIPOX Products Lineup

Polishing Films High precision finish Versatile base film with excellent resistance to both water and oil Enable to use automated polishing equipments Micromotors and Commutators Hard disks LCD panels and Color filters Fiber optic connectors Magntic heads Semiconductor substrates

Abrasive materials: [GC](SiC)Green silicon carbide / [WA](Al2O3)White aluminum oxide / [K](Cr2O3)Chrome oxide / [ROI](Fe2O3)Iron oxide [D](C)Diamond / [CE](CeO2)Cerium oxide / [SO(SI)](SiO2)Silicon oxide Base film thickness [PET]75μm(3mil) / 50μm(2mil) / 25μm(1mil) Mesh New Mohs hadness scale FINAL 20000 15000 10000 8000 6000 4000 3000 2000 1500 1200 1000 800 600 400 μm     0.2 0.3 0.5 1 2 3 5 9 12 15 16 20 30 40 GC 13   Ο Ο Ο Ο Ο Ο Ο Ο     Ο Ο Ο Ο WA 12   Ο   Ο Ο Ο Ο Ο Ο Ο   Ο Ο Ο Ο K 8     Ο Ο Ο                     ROI 7     Ο                         D 15   Ο   Ο Ο Ο Ο Ο Ο   Ο     Ο   CE 9       Ο Ο                     SO(SI) 8 Ο     Ο                       Please contact us for some combinations of the components are not possible. If you require base film thickness other than what is listed above, please consult us. Besides polyseter base films, we offer various base films such as non-woven fiber, woven fiber, flocked pile, synthetic paper and so on. Type Size Base ID Roll type 3 inch 2 inch 1 inch 3/4 inch 1/2 inch 1/4 inch 1/7 inch X 100M 25μm 50μm 75μm 3 inch 1 inch Plastic core winding Sheet type 228mm X 280mm (9 inch X 11 inch) 75μm   Disk type 76mmφ 110mmφ 127mmφ 203mmφ 75μm   If you require sizes other than what listed below, please consult with us.

VARIOFILM Smooth and strong polyester films with uniform thickness Uniform and stable polishing performances by abrasive particles coated by advanced statically charged coating technology Special back coating is offerd for skid proof products Crank shafts Cam shafts OA equipment rubber rollers Printing rollers Various metal shafts, etc.

Abrasive materials [WA](Al2O3)White aluminum oxide/ [CC](SiC)Silicon carbide Base film thickness [PET]125μm(5mil) Mesh FINAL 4000 3000 2000 1500 1000 800 600 400 360 320 Back coating Base film thickness Applications (μm)   3 5 9 12 15 20 30 40 50 60 WA       Ο Ο Ο Ο Ο Ο Ο Ο Ο 125μ 5 mil Crank shafts, Cam shafts, Metal shafts CC           Ο Ο Ο Ο   Ο Ο 125μ 5 mil Crank shafts, Rubber rollers FINAL Ο                     Ο 125μ 5 mil Mirror finish polishing of metal shafts and rolls

Polishing Slurry Reduced scratches by state of the art despersion technology Controlled particle sizes by our proprietary classfication technology Diamond slurry: Hard disks, Polishing of compound seniconductor such as sapphire waffers Cerium slurry: Polishing of fiber optical end faces, removal of scratches from glass panels

Abrasive materials [D](C)Diamond / [CE](CeO2)Cerium oxide / (SiO2)Silicon oxide Mesh 100000 80000 20000 10000 8000 4000 3000 1000 800 (μm) 0.02 0.03 0.12 0.5 1 3 6 20 30 D Ο Ο Ο   Ο Ο Ο Ο Ο CE     Ο           SiO2 Ο

Polishing Pads Cobines high polish rate, high durability and produces excellent flatness and surface finish Possible to create customized products based on yourplaten sizes Semiconductor, compound semiconductor back pads and others Finish polishing of semiconductor Semiconductor 1st step polish(round polish) CMP, compound semiconductor and so on

Type Description Base film thickness Thickness(mm) Comparessibility(%) Suede DSM-100 PET film 0.55-0.60 10-35 DSM-500 Non woven 1.20-0.40 5-15 Smooth DSM-200 PET film 0.40-0.60 2-5 Non woven DSM-400 - 1.20-1.40 3-10 Non cell NCP - 1.50 Below 2

Polishing Machine Enable to perform polishing without chemicals by using polishing tapes Easy to achieve uniform polishing quality in a short time without clogging Polishing of silicon wafer and compound semiconductor edge Polishing of LCD panel and other substrates surfaces Polishing of metal shafts and OA equipment rubber rollers, etc. Polishing of quality assessment

Name of device Photo Applications Polishing mechanism Edge polisher Polishing of silicon wafer edge Polishing of compound semiconductor edge Panel cleaner Polishing of foreign materials from the substrates of LCD panels Polishing of other substrates surfaces Micro finisher Polishing of metal shafts Polishing of OA equipment rubber rollers, etc. Tape lapping machine Polishing of quality assessment OSC polishing machine Polishing of quality assessment Hoop material polisher (FPC polisher) Polishing of flexible printed wiring board (FPC)

Shape Applications Cylinders Crank shafts Copy and facsimile rollers Resin motors Micromotors and commutators Small scale shafts Flat surfaces Substrates(Aluminum alloy, glass) Stamper(Optical disk) LCD panels, color filters Plasma display panels Multiple layer laminate substrates Ceramics substrates Video tapes Curved surfaces Magnetic heads Video heads Fiber optic connectors Rocker arms Rotary compressor valves Glass and plastic lenses