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Compound Semiconductor Polishing Slurry |
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3μm |
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1μm |
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| Polycrystalline Diamond Slurry |
| Polycrystalline diamond slurry has a wide range of particle sizes and fulfills a variety of polishing needs such as rough, middle and the pre-finish polishing of compound semiconductors. |
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| Nanodiamond Slurry |
| Nanodiamond slurry also meets many polishing needs such as the pre-finish polishing of compound semiconductors. Conventionally, final polishing is carried out by using polishing slurry and a polishing pad, but in our polishing method, the use of a nano-level ultra-fine particle diamond slurry removes the need of using a polishing pad and still allows nano-surface level* finishing. |
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*Angstrom Surface is a registered trademark of Nihon Micro Coating Co., Ltd.
Polishing Process for GaN
| Diamond |
2-4μm |
0-2μm |
0.03μm |
Ra
(Zygo) |
 |
 |
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Wa
(Zygo) |
 |
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Polishing Process for SiC
| Diamond |
2-4μm |
0-2μm |
0.03μm |
Ra
(Zygo) |
 |
 |
 |
Wa
(Zygo) |
 |
 |
 |
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GaN (Gallium Nitride)
Today LEDs - light emitting diodes - can be seen in many uses such as signals or lighting. GaN is used to give a blue light source for an LED and also for the laser of optical pickup units of HD-DVD and the Blue-ray Disc - the newly acclaimed next-generation optical disc. Further market growth of GaN substrates can be expected and we have developed a new polishing method for the surface precision finishing of GaN substrates.
Conventionally, final polishing is carried out by using polishing slurry and a polishing pad, but in our polishing method, the use of a nano-level ultra-fine particle diamond slurry removes the need of using a polishing pad and still allows nano-surface level finishing. |
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