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In the most advanced semiconductor manufacturing processes, the multilevel interconnection is gaining in popularity and it is CMP - Chemical Mechanical Polishing/Planarization - that has greatly contributed to this technology. Nihon Micro Coating develops and manufactures CMP polishing pads for semiconductors; every year the surfaces and finish required become finer and the processes are now measured in nanos and angstroms. These are the very fields in which Nihon Micro Coating has specialized and by making good use of our high precision polishing technology, we have actively contributed to the planarization of semiconductors.
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| Semiconductor CMP Pads |
Oxide film CMP (STI, ILD, BPSG)
Metal CMP (W, Cu)
Buff polishing
Silicon wafer polishing
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