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Silicon Wafer Edge Polisher |
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Because of its capability to increase throughput and improve surface precision in the wafer manufacturing process, the MIPOX silicon wafer edge polisher is now found all over the world.
This edge polisher, compatible with 6, 8, or 12 inch wafers, uses polishing tape with a fixed-abrasive; the tape is made by our own special manufacturing method and can be fed through the machine during polishing, making it possible to constantly polish with a new abrasive surface and also give a consistent polishing capability.
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| Silicon Wafer Edge Polisher |
High throughput for any type of wafer
Improves surface precision
Chemical free polishing
Removes various types of films
Can be introduced at any stage of the wafer manufacturing process |
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Polishing Head Mechanism Diagram
Applications
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The silicon wafer edge polisher can be applied to a variety of different processes. |
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It has been used at each stage of the manufacturing process of silicon wafers - after beveling and etching or CVD film removal. It is also effective for the reclaiming and the removal of a variety of metal films. |
Specifications
| Dimensions |
2250mm（H）×2000mm（W）×2200mm（D） |
| Weight |
Approx. 2,500Kg |
| Power supply, Power voltage |
AC200V/220V 3φ 50Hz/60Hz 30A |
| Required water pressure |
0.2～0.5Mpa（0～4L/min） |
| Required air pressure |
Air pressure: 0.5Mpa~0.8Mpa |
| Consumption |
20NL/min |
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